CVE-2023-33063CISA KEVEPSS p45.8%

CVE-2023-33063Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm / Multiple Chipsets

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Scoring

EPSS0.58% probability of exploitation · percentile 45.8% · 2026-10-05T12:00:23Z

CISA KEV entry

Added to KEV: 2023-12-05

(incoming)1

TypeTargetConfidenceTier
KEVEntryQualcomm Multiple Chipsets Use-After-Free Vulnerabilitykev-cve-2023-330630%live

Related by meaning· 6

Nearest entities by semantic similarity across the cs-graph corpus.

CVE
Qualcomm Multiple Chipsets Integer Overflow Vulnerability
CVE
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
CVE
Qualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability
CVE
Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
CVE
Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
CVE
Samsung Mobile Devices Use-After-Free Vulnerability
Sourced from NVD + CISA KEV + FIRST.org EPSS. Curated for EU compliance use cases by Adam Lundqvist, Founder at SQUR.